IITC 2020 23rd International Interconnect Technology Conference June 1-4, 2020
San Jose, California
Program at a Glance    Tuesday    Wednesday    Thursday    Friday    Author Index    Keyword Index  

Last updated on September 21, 2020. This conference program is tentative and subject to change

Technical Program for Tuesday October 6, 2020

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TuAT1 Room T1
Session 3:  Advanced Interconnect 1 Lecture session
08:30-09:00, Paper TuAT1.1 
Advanced BEOL Interconnects

Nogami, TakeshiIBM Research
09:00-09:25, Paper TuAT1.2 
Semidamascene Interconnects for 2nm Node and Beyond

Murdoch, GayleImec
Tőkei, ZsoltImec
Paolillo, SaraImec
Varela Pedreira, OlallaImec
Vanstreels, KrisIMEC
Wilson, ChrisImec
09:25-09:50, Paper TuAT1.3 
Thermodynamic Exploration of Co–Alloy Diffusion Barriers for Advanced Cu Interconnect

Yamada, YukiTohoku University
Yahagi, MasatakaTohoku University
Koike, JunichiTohoku University
09:50-10:15, Paper TuAT1.4 
Wafer Surface Control for Ru Capping on Cu Interconnect

Aizawa, HirokazuTEL
TuBT2 Room T2
Session 4:  Advanced Interconnect 2 Lecture session
11:15-11:40, Paper TuBT2.2 
Co-Doped Ru Liners for Highly Reliable Cu Interconnects with Selective Co Cap

Motoyama, KoichiIBM
van der Straten, OscarIBM
Maniscalco, JosephIBM
Cheng, KennethIBM
DeVries, ScottIBM
Huang, HuaiIBM
Shen, TianIBM
Lanzillo, NickIBM Research
Shobha, HosadurgaIBM
Park, KihyunSamsung
Bae, TaeyonSamsung
Seo, HoonseokIBM
Wu, TeresaIBM
Spooner, TerryIBM
Choi, KisikIBM
11:40-12:05, Paper TuBT2.3 
Hybrid Metallization with Cu in Sub 30nm Interconnects

van der Veen, Marleen H.Imec
Soethoudt, JobImec
Delabie, AnneliesImec
Varela Pedreira, OlallaImec
Vega Gonzalez, VictorImec
Lariviere, StéphaneImec
Teugels, LieveImec
Jourdan, NicolasImec
Decoster, StefanImec
Struyf, HerbertImec
Wilson, ChrisImec
Croes, KristofImec
Tőkei, ZsoltImec
12:05-12:30, Paper TuBT2.4 
Design of Mechanically Reliable ULK Glasses

Kilic, KarsuStanford University
Dauskardt, ReinholdStanford University




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