IITC 2020 23rd International Interconnect Technology Conference June 1-4, 2020
San Jose, California
Program at a Glance    Tuesday    Wednesday    Thursday    Friday    Author Index    Keyword Index  

Last updated on September 21, 2020. This conference program is tentative and subject to change

IITC 2020 Keyword Index

3   A   C   M   N   P   R  

3D integration & packaging concerns: WtW/CtW bonding, Interposer, Through Si Via, CPIFrAT1.3, FrAT1.4, WeDT4.5, WeDT4.13
Advanced interconnect metallizations with low-k dielectrics as well as optical, wireless, and carbon-based interconnects, beyond CuFrBT2.2, FrBT2.3, FrBT2.6, ThBT2.2, ThCT3.2, ThCT3.3, ThCT3.4, ThCT3.5, TuAT1.1, TuAT1.2, TuBT2.2, TuBT2.3, WeAT1.4, WeCT3.1, WeDT4.1, WeDT4.11, WeDT4.13, WeDT4.14, WeDT4.16, WeDT4.18, WeDT4.20, WeDT4.22, WeDT4.23, WeDT4.24
Advanced material/process characterization, design-technology co-optimization, and modelling techniquesFrBT2.5, ThBT2.3, ThCT3.3, TuBT2.4, WeAT1.4, WeBT2.2, WeBT2.3, WeCT3.2, WeCT3.3, WeCT3.4, WeDT4.3, WeDT4.6, WeDT4.10, WeDT4.11, WeDT4.14, WeDT4.17, WeDT4.23
Contacts on MOS devices: Silicide, III-V, 2D materialsFrBT2.3, FrBT2.4, ThAT1.2, ThAT1.3, WeBT2.3, WeDT4.7
Materials and Unit Processes: Dielectrics, Metals, barriers, Wet, CMP, PVD, CVD, patterningFrBT2.2, FrBT2.4, FrBT2.6, ThAT1.2, ThCT3.4, TuAT1.3, TuAT1.4, TuBT2.3, TuBT2.4, WeAT1.1, WeCT3.3, WeDT4.1, WeDT4.2, WeDT4.4, WeDT4.8, WeDT4.9, WeDT4.12, WeDT4.15, WeDT4.16, WeDT4.18, WeDT4.19, WeDT4.20, WeDT4.21, WeDT4.22
Memory architecture: CBRAM, PCRAM, ReRAM, MRAM, DRAM, 3DNANDWeDT4.2, WeDT4.3, WeDT4.15, WeDT4.21
Novel Form Factors: flexible electronics, wearablesWeDT4.5
Novel System and Emerging Technology: Energy harvesting, brain-inspired computingWeCT3.4, WeDT4.3
Process integration, via/trench patterningFrAT1.3, FrAT1.4, FrBT2.4, ThBT2.3, TuAT1.1, TuAT1.2, WeAT1.1, WeBT2.3, WeCT3.4, WeDT4.5, WeDT4.6
Reliability and Failure analysis, techniques and methodsFrBT2.5, ThBT2.1, ThBT2.2, ThBT2.3, ThCT3.5, TuBT2.2, WeDT4.6, WeDT4.10, WeDT4.21




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