25th International Interconnect Technology Conference June 27-30  |  San Jose, California
  
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Last updated on June 16, 2022. This conference program is tentative and subject to change

Technical Program for Tuesday June 28, 2022

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TuK1N Room T2
Keynote: Ravi Mahajan Keynote session
 
08:35-09:25, Paper TuK1N.1 
Directions, Challenges and Opportunities in Heterogeneous Integration

Mahajan, RaviIntel Corporation
 
TuK2N Room T2
Keynote: Anthony Yen Keynote session
 
09:25-10:15, Paper TuK2N.1 
EUV Lithography: What’s up and What’s Next

Yen, AnthonyASML
 
TuAT1 Room T1
3D Integration and Advanced Packaging I Lecture session
 
11:05-11:35, Paper TuAT1.2 
Ponte Vecchio : Building a Foundation to Enable 1000X Scaling for the Third Dimension of Moore's Law

Gomes, WilfredIntel Corporation
 
11:35-12:00, Paper TuAT1.3 
Pixel Pitch Hybrid Bonding and Three Layer Stacking Technology for BSI Image Sensor

Tanida, KazumasaTower Partners Semiconductor Co., Ltd
Suzuki, ShigeruTower Partners Semiconductor Co., Ltd
Seo, ToshikiTower Partners Semiconductor Co., Ltd
Morinaga, YasunoriTower Partners Semiconductor Co., Ltd
Korogi, HayatoTower Partners Semiconductor Co., Ltd
Tetani, MichinariTower Partners Semiconductor Co., Ltd
Hamada, MasakazuTower Partners Semiconductor Co., Ltd
Eto, RyujiTower Partners Semiconductor Co., Ltd
Yamashita, TakeshiTower Partners Semiconductor Co., Ltd
Kato, YasuhiroTower Partners Semiconductor Co., Ltd
Sato, NaoakiTower Partners Semiconductor Co., Ltd
Shimizu, TadamiTower Partners Semiconductor Co., Ltd
Hanawa, TetsuroTower Partners Semiconductor Co., Ltd
Kubo, HirokoTower Partners Semiconductor Co., Ltd
Ueda, KenjiTower Partners Semiconductor Co., Ltd
Ito, FumitakaTower Partners Semiconductor Co., Ltd
Noguchi, YoshihiroTower Partners Semiconductor Co., Ltd
Nakamura, MasayukiTower Partners Semiconductor Co., Ltd
Mizukoshi, RyujiTower Partners Semiconductor Co., Ltd
Takeuchi, MasahikoTower Partners Semiconductor Co., Ltd
Suzuki, MasakatsuTower Partners Semiconductor Co. Ltd
Niisoe, NaotoTower Partners Semiconductor Co., Ltd
Miyanaga, IsaoTower Partners Semiconductor Co., Ltd
Ikeda, AtsushiTower Partners Semiconductor Co., Ltd
Matsumoto, SusumuTower Partners Semiconductor Co., Ltd
 
TuBT1 Room T1
3D Integration and Advanced Packaging II Lecture session
 
13:20-13:50, Paper TuBT1.1 
Cu Hybrid Bonding Process Key Challenges and Solutions to C2W and W2W Bonding Applications

Zhou, WeiMicron
 
13:50-14:20, Paper TuBT1.2 
Nanoengineered CTE Tailorable Copper Solder for Robust High Performance Heterogeneous Integration and Packaging

Zinn, AlfredKuprion Inc
 
14:20-14:45, Paper TuBT1.3 
TSV Fabrication Technology Using Direct Electroplating of Cu on the Electroless Plated Barrier Metal

Shingubara, ShosoKansai University
Shimizu, TomohiroKansai University
Matsui, KosukeTosetsu Inc
Miyake, YukoTosetsu Inc
Torinari, YuichiroTosetsu Inc
Motoyoshi, MakotoTohoku-Micro Tec
Watariguchi, ShigeruMeltex Inc
Watanabe, HidekiMeltex Inc
 
TuCT1 Room T1
Memory and Emerging Technologies Lecture session
 
15:05-15:35, Paper TuCT1.1 
A Materials to Systems Understanding of a BEOL Embedded Analog NVM Memory Technology for Edge Compute Applications

Chudzik, MichaelApplied Materials
 
15:35-16:05, Paper TuCT1.2 
Demonstration of HfO2-Based BEOL-Integrated Ferroelectric Memories: Current Status and Future Challenges

Grenouillet, LaurentCEA-LETI
 
16:05-16:35, Paper TuCT1.3 
Via-Switch FPGA with Transistor-Free Programmability

Hashimoto, MasanoriKyoto University
 
16:35-17:00, Paper TuCT1.4 
Carbon Plug Application in 3D NAND Fabrication

Chang, Yu ChihMacronix International Co. Ltd
Chen, Liang-YuMacronix International Co. Ltd
Chen, Kuang-WeiMacronix International Co. Ltd
Luoh, TuungMacronix International Co. Ltd
Yang, Ling-WuuMacronix International Co. Ltd
Yang, Ta-HoneMacronix International Co. Ltd
Chen, Kuang-ChaoMacronix International Co. Ltd
 
17:00-17:25, Paper TuCT1.5 
Investigations at Low Temperature of 90 nm Pitch BEOL for Quantum Applications

Segaud, RoselyneCEA-LETI
Gergaud, PatriceCEA Grenoble
Minoret, StephaneCEA-Leti
Neumann, PaulCEA-Leti
Gustavo, FredericDRF
Royer, AgnesCEA, LETI
Licitra, ChristopheCEA-LETI
Denis, MariolleUniv. Grenoble Alpes, CEA, LETI
Nemouchi, FatriceCEA Grenoble

 
 

 
 

 

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