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Last updated on June 16, 2022. This conference program is tentative and subject to change
IITC 2022 Keyword Index
3
A
C
M
N
P
R
3 | Top |
3D integration & packaging concerns: WtW/CtW bonding, Interposer, Through Si Via, CPI | TuAT1.3, TuBT1.3, WePoT1.6, WePoT1.8, WePoT1.11, WePoT1.16, WePoT1.17 |
A | Top |
Advanced interconnect metallizations with low-k dielectrics as well as optical, wireless, and carbon-based interconnects, beyond Cu | ThAT1.2, ThAT1.3, ThAT1.4, ThAT1.5, ThBT1.3, ThCT1.4, TuBT1.3, WeAT1.1, WeAT1.3, WeBT1.1, WeCT1.2, WeDT1.2, WeDT1.3, WeDT1.4, WeDT1.5, WePoT1.2, WePoT1.5, WePoT1.10, WePoT1.12, WePoT1.13, WePoT1.15, WePoT1.18 |
Advanced material/process characterization, design-technology co-optimization, and modelling techniques | ThAT1.4, ThBT1.1, ThBT1.2, ThBT1.3, ThCT1.1, ThCT1.2, TuAT1.2, TuBT1.1, TuCT1.3, TuK1N.1, WeAT1.4, WeAT1.5, WeBT1.3, WeCT1.3, WeDT1.1, WePoT1.1, WePoT1.3 |
C | Top |
Contacts on MOS devices: Silicide, III-V, 2D materials | ThAT1.1, WePoT1.9 |
M | Top |
Materials and Unit Processes: Dielectrics, Metals, barriers, Wet, CMP, PVD, CVD, patterning | ThAT1.5, ThCT1.3, ThCT1.4, TuBT1.2, TuCT1.1, TuCT1.4, TuK2N.1, WeBT1.2, WeBT1.3, WeCT1.3, WePoT1.4, WePoT1.6, WePoT1.7, WePoT1.8, WePoT1.11, WePoT1.12, WePoT1.14 |
Memory architecture: CBRAM, PCRAM, ReRAM, MRAM, DRAM, 3DNAND | TuCT1.2, TuCT1.4, WeCT1.1 |
N | Top |
Novel System and Emerging Technology: Energy harvesting, brain-inspired computing | TuCT1.5, WePoT1.7 |
P | Top |
Process integration, via/trench patterning | ThBT1.2, ThCT1.2, TuK2N.1, WeBT1.3, WeCT1.1, WeCT1.2, WeCT1.3, WeDT1.3, WeDT1.4, WePoT1.5 |
R | Top |
Reliability and Failure analysis, techniques and methods | ThCT1.1, ThCT1.2, ThCT1.3, WeAT1.1, WeAT1.2, WeAT1.3, WeAT1.4, WeAT1.5, WeCT1.1, WeCT1.2, WePoT1.1, WePoT1.2, WePoT1.13, WePoT1.14, WePoT1.18 |
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