25th International Interconnect Technology Conference June 27-30  |  San Jose, California
Program at a Glance    Tuesday    Wednesday    Thursday    Author Index    Keyword Index  

Last updated on June 16, 2022. This conference program is tentative and subject to change

IITC 2022 Keyword Index

3   A   C   M   N   P   R  

3D integration & packaging concerns: WtW/CtW bonding, Interposer, Through Si Via, CPITuAT1.3, TuBT1.3, WePoT1.6, WePoT1.8, WePoT1.11, WePoT1.16, WePoT1.17
Advanced interconnect metallizations with low-k dielectrics as well as optical, wireless, and carbon-based interconnects, beyond CuThAT1.2, ThAT1.3, ThAT1.4, ThAT1.5, ThBT1.3, ThCT1.4, TuBT1.3, WeAT1.1, WeAT1.3, WeBT1.1, WeCT1.2, WeDT1.2, WeDT1.3, WeDT1.4, WeDT1.5, WePoT1.2, WePoT1.5, WePoT1.10, WePoT1.12, WePoT1.13, WePoT1.15, WePoT1.18
Advanced material/process characterization, design-technology co-optimization, and modelling techniquesThAT1.4, ThBT1.1, ThBT1.2, ThBT1.3, ThCT1.1, ThCT1.2, TuAT1.2, TuBT1.1, TuCT1.3, TuK1N.1, WeAT1.4, WeAT1.5, WeBT1.3, WeCT1.3, WeDT1.1, WePoT1.1, WePoT1.3
Contacts on MOS devices: Silicide, III-V, 2D materialsThAT1.1, WePoT1.9
Materials and Unit Processes: Dielectrics, Metals, barriers, Wet, CMP, PVD, CVD, patterningThAT1.5, ThCT1.3, ThCT1.4, TuBT1.2, TuCT1.1, TuCT1.4, TuK2N.1, WeBT1.2, WeBT1.3, WeCT1.3, WePoT1.4, WePoT1.6, WePoT1.7, WePoT1.8, WePoT1.11, WePoT1.12, WePoT1.14
Memory architecture: CBRAM, PCRAM, ReRAM, MRAM, DRAM, 3DNANDTuCT1.2, TuCT1.4, WeCT1.1
Novel System and Emerging Technology: Energy harvesting, brain-inspired computingTuCT1.5, WePoT1.7
Process integration, via/trench patterningThBT1.2, ThCT1.2, TuK2N.1, WeBT1.3, WeCT1.1, WeCT1.2, WeCT1.3, WeDT1.3, WeDT1.4, WePoT1.5
Reliability and Failure analysis, techniques and methodsThCT1.1, ThCT1.2, ThCT1.3, WeAT1.1, WeAT1.2, WeAT1.3, WeAT1.4, WeAT1.5, WeCT1.1, WeCT1.2, WePoT1.1, WePoT1.2, WePoT1.13, WePoT1.14, WePoT1.18




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