25th International Interconnect Technology Conference June 27-30  |  San Jose, California
  
Program at a Glance    Tuesday    Wednesday    Thursday    Author Index    Keyword Index  

Last updated on June 16, 2022. This conference program is tentative and subject to change

IITC 2022 Keyword Index

3   A   C   M   N   P   R  

3Top
3D integration & packaging concerns: WtW/CtW bonding, Interposer, Through Si Via, CPITuAT1.3, TuBT1.3, WePoT1.6, WePoT1.8, WePoT1.11, WePoT1.16, WePoT1.17
ATop
Advanced interconnect metallizations with low-k dielectrics as well as optical, wireless, and carbon-based interconnects, beyond CuThAT1.2, ThAT1.3, ThAT1.4, ThAT1.5, ThBT1.3, ThCT1.4, TuBT1.3, WeAT1.1, WeAT1.3, WeBT1.1, WeCT1.2, WeDT1.2, WeDT1.3, WeDT1.4, WeDT1.5, WePoT1.2, WePoT1.5, WePoT1.10, WePoT1.12, WePoT1.13, WePoT1.15, WePoT1.18
Advanced material/process characterization, design-technology co-optimization, and modelling techniquesThAT1.4, ThBT1.1, ThBT1.2, ThBT1.3, ThCT1.1, ThCT1.2, TuAT1.2, TuBT1.1, TuCT1.3, TuK1N.1, WeAT1.4, WeAT1.5, WeBT1.3, WeCT1.3, WeDT1.1, WePoT1.1, WePoT1.3
CTop
Contacts on MOS devices: Silicide, III-V, 2D materialsThAT1.1, WePoT1.9
MTop
Materials and Unit Processes: Dielectrics, Metals, barriers, Wet, CMP, PVD, CVD, patterningThAT1.5, ThCT1.3, ThCT1.4, TuBT1.2, TuCT1.1, TuCT1.4, TuK2N.1, WeBT1.2, WeBT1.3, WeCT1.3, WePoT1.4, WePoT1.6, WePoT1.7, WePoT1.8, WePoT1.11, WePoT1.12, WePoT1.14
Memory architecture: CBRAM, PCRAM, ReRAM, MRAM, DRAM, 3DNANDTuCT1.2, TuCT1.4, WeCT1.1
NTop
Novel System and Emerging Technology: Energy harvesting, brain-inspired computingTuCT1.5, WePoT1.7
PTop
Process integration, via/trench patterningThBT1.2, ThCT1.2, TuK2N.1, WeBT1.3, WeCT1.1, WeCT1.2, WeCT1.3, WeDT1.3, WeDT1.4, WePoT1.5
RTop
Reliability and Failure analysis, techniques and methodsThCT1.1, ThCT1.2, ThCT1.3, WeAT1.1, WeAT1.2, WeAT1.3, WeAT1.4, WeAT1.5, WeCT1.1, WeCT1.2, WePoT1.1, WePoT1.2, WePoT1.13, WePoT1.14, WePoT1.18

 
 

 
 

 

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