The PaperCept Conference Manuscript Management System

 
Welcome to PaperPlaza Conference Submission and Review Management System

  • Login NOT required: During initial submission cycle you "do not" need to login to the system to submit a paper, session proposal, or other contribution . To submit a paper to the conferences listed below, you may follow the "Submit a contribution" link.
  • Login REQUIRED: For Administrative or Editorial activities; to submit a review or to update reupload your paper, or to see the reviews of your paper; and to submit the final version of your paper you MUST log in. Once logged in, kindly use "Access" link to switch your roles. Follow the link Log in
  • Personal Information: Two additional fields (Employment status and Experience) have been added to your personal profile. Kindly update your personal information and fill these two fields. This information is requested to assist in allocating papers to potential reviewers with an appropriate level of background experience.
 
­Upcoming Conferences
Please click here to see important information about PINs, pdf compliance, browser settings, server security and spam filters at the bottom of the page
Download Get Started manuals for authors and reviewers
 
Conferences in 2023
MWSCAS 2023 2023 IEEE 66th International Midwest Symposium on Circuits and Systems.
August 6-9, 2023, Phoenix, Arizona, USA
Last updated March 6, 2023. Welcome to MWSCAS 2023! Please submit your paper by the deadline of April 7, 2023.
WCMNM 2023 6th World Congress on Micro and Nano Manufacturing.
September 19-21, 2023, Evanston, IL, USA
Last updated February 7, 2023.
Deadline for revised final paper submission: April 15, 2023
SMC 2023 2023 IEEE International Conference on Systems, Man, and Cybernetics (SMC).
October 1-4, 2023, Maui, Hawaii, USA
Last updated March 13, 2023. Submission deadline for all papers is April 15, 2023. Please use only the following templates Templates for your submission - no other template should be used, or you will run into margin problems.
TENCON 2023 2023 IEEE Region 10 Conference (TENCON).
October 31 - November 3, 2023, Chiang Mai, Thailand
Last updated January 4, 2023. Please use the Word or LaTeX templates AVAILABLE HERE to prepare your manuscripts. Please disregard any other templates you may have used in the past, as they will not work. Deadline for submissions is Oct 10 for full papers and Oct 20 for 1-page abstracts
March 1, 2023  Initial submission update extension change: Special session proposal extended by 10 Days
March 16, 2023  Initial submission deadline change: Special session proposal March 20, 2023
SSCI 2023 2023 IEEE Symposium Series on Computational Intelligence (SSCI).
December 5-8, 2023, Mexico City, Mexico
Last updated January 22, 2023. The conference site is being configured, submission links will be available soon.
   
PIN
Every participant in a conference served by this site, in any capacity, must maintain a single PIN and password. The same PIN must be used for all conferences
  • Follow the link PIN to register a PIN, to check and update your personal information, or to retrieve your password. You may also look up your co-authors' PINs or register PINs for them
  • To comply with the General Data Protection Regulation, the first time when you login to a new account, you will be directed to the required opt-in consent form before you can use your account in any capacity for products and services offered through this site
  • Each of our subdomains has its own people database. PINs are therefore only valid on the subdomain where they have been registered.
Pdf Compliance and On-Line Pdf Test
All papers submitted to conferences supported by this site need to be prepared as compliant pdf files
  • Follow the link Support for MS Word templates and LaTeX style files, and for information about the correct settings to convert your MS Word or LaTeX file to compliant pdf
  • Use the on-line pdf test to validate your pdf file before trying to upload it
JavaScript and Cookies
For proper utilization of this portal, you must have JavaScript enabled on your browser.
  • The portal solely relies on cookies to help tailor user experience.
  • We do not use or allow third party services to collect information about how users use our site. See the Section 'Use of Cookies' of the Terms of Use.
E-mail and Spam
  • Some anti-spam software mistakenly considers automated e-mail messages such as sent by this system spam. Instruct your anti-spam software to accept e-mail from conf.101@papercept.net
  • The system is unable to follow up on requests from certain anti-spam software for sender confirmation. If your institution uses such software consider using a private e-mail address. You may list several e-mail addresses
  • Owing to sheer large numbers we are unable to follow up on the many e-mails sent by the system that are returned because of invalid e-mail addresses or overfull mailboxes
Supported Browsers
This site has been designed for and tested on recent versions of all major browsers, in particular Mozilla Firefox, Google Chrome and Microsoft Edge. Certain features may not work properly on unsupported browsers such as Microsoft Internet Explorer, Opera and Safari.
 
 

All Content © PaperCept, Inc..


This site is protected by copyright and trademark laws under US and International law.
All rights reserved. © 2002-2023 PaperCept, Inc.
Page generated 2023-03-21  08:05:08 PST  Terms of use