The PaperCept Conference Manuscript Management System

Welcome to PaperPlaza Conference Submission and Review Management System

  • Login NOT required: During initial submission cycle you "do not" need to login to the system to submit a paper, session proposal, or other contribution . To submit a paper to the conferences listed below, you may follow the "Submit a contribution" link.
  • Login REQUIRED: For Administrative or Editorial activities; to submit a review or to update reupload your paper, or to see the reviews of your paper; and to submit the final version of your paper you MUST log in. Once logged in, kindly use "Access" link to switch your roles. Follow the link Log in
  • Personal Information: Two additional fields (Employment status and Experience) have been added to your personal profile. Kindly update your personal information and fill these two fields. This information is requested to assist in allocating papers to potential reviewers with an appropriate level of background experience.
­Upcoming Conferences
Please click here to see important information about PINs, pdf compliance, browser settings, server security and spam filters at the bottom of the page
Download Get Started manuals for authors and reviewers
Conferences in 2023
SSCI 2023 2023 IEEE Symposium Series on Computational Intelligence (SSCI).
December 5-8, 2023, Mexico City, Mexico
Last updated July 1, 2023. Submission deadline is July 31. Follow the submission link to the right to see codes for various symposia and special sessions. Please use only the templates available from: TEMPLATES for your submission
Conferences in 2024
ICSM 2024 2024 International Conference on Smart Multimedia.
March 27-29, 2024, Redondo Beach, Los Angeles, USA
Last updated January 19, 2024. We encourage authors to submit Late Breaking Papers. The deadline is January 31, 2024.
IITC 2024 2024 IEEE International Interconnect Technology Conference (IITC).
June 3-6, 2024, San Jose, California
Last updated December 14, 2023. The 27th edition of the International Interconnect Technology Conference (IITC) will be held at the Marriott hotel on June 3-6, 2024 in San Jose, California. Authors are encouraged to submit their original work describing innovative research and development in the critically important field of on-chip interconnects. The conference seeks papers on all aspects of BEOL/MOL interconnects and metallization, including design, unit process, integration and reliability. The deadline for submission of abstracts is February 12, 2024.

IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications. The conference seeks papers on all aspects of BEOL/MOL interconnects and metallization, including design, unit process, integration and reliability.

Submission deadline is Feb. 12, 2024
SMC 2024 2024 IEEE International Conference on Systems, Man, and Cybernetics (SMC).
October 6-10, 2024, Sarawak, Malaysia
Last updated February 15, 2024. Manuscripts should be submitted by April 8, 2024
Please use only the following templates LaTeX or MS-Word for your submission - no other template should be used, or you will run into margin and page format problems.

February 15, 2024  Initial submission deadline change: Workshop Session Proposals February 23, 2024
February 15, 2024  Initial submission deadline changes: Special Session Proposals February 29, 2024, Tutorial Session Proposals February 29, 2024, Workshop Session Proposals February 29, 2024
March 3, 2024  Initial submission deadline changes: Special Session Proposals March 6, 2024, Tutorial Session Proposals March 6, 2024, Workshop Session Proposals March 6, 2024
April 3, 2024  Initial submission deadline changes: Regular Papers April 30, 2024, Special Session Papers April 30, 2024, Workshop Session Papers April 30, 2024, BMI Workshop Regular Papers April 30, 2024, BMI Workshop Special Session Papers April 30, 2024
ICFES 2024 2024 1st International Conference on Flexible Electronics and Systems (ICFES).
December 12-14, 2024, Hong Kong, China
Last updated April 11, 2024. Submission links will be available soon.
Every participant in a conference served by this site, in any capacity, must maintain a single PIN and password. The same PIN must be used for all conferences
  • Follow the link PIN to register a PIN, to check and update your personal information, or to retrieve your password. You may also look up your co-authors' PINs or register PINs for them
  • To comply with the General Data Protection Regulation, the first time when you login to a new account, you will be directed to the required opt-in consent form before you can use your account in any capacity for products and services offered through this site
  • Each of our subdomains has its own people database. PINs are therefore only valid on the subdomain where they have been registered.
Pdf Compliance and On-Line Pdf Test
All papers submitted to conferences supported by this site need to be prepared as compliant pdf files
  • Follow the link Support for MS Word templates and LaTeX style files, and for information about the correct settings to convert your MS Word or LaTeX file to compliant pdf
  • Use the on-line pdf test to validate your pdf file before trying to upload it
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E-mail and Spam
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  • The system is unable to follow up on requests from certain anti-spam software for sender confirmation. If your institution uses such software consider using a private e-mail address. You may list several e-mail addresses
  • Owing to sheer large numbers we are unable to follow up on the many e-mails sent by the system that are returned because of invalid e-mail addresses or overfull mailboxes
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